Apple SoC Thermal Architect/Lead in Santa Clara Valley, California

SoC Thermal Architect/Lead

Job Number: 86438726

Santa Clara Valley, California, United States

Posted: 18-Jul-2017

Weekly Hours: 40.00

Job Summary

We are looking for a self-motivated individual who will work closely with cross functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

Key Qualifications

  • 5+ years of industry experience in thermal analysis and modeling of System on Chip (SoCs), IC packages and mobile devices

  • Experience in modeling transient thermal response and reduced-order modeling in mobile devices

  • Knowledge of semiconductor, package, PCB or mobile device design and thermal testing

  • Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies

  • Knowledge of SoC design methodology, low-power techniques and thermal analysis methods

  • Knowledge of advanced packaging assembly processes, along with, electrical and thermal characteristics of packages

  • Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk, etc

  • Ability to drive and lead cross-functional teams to execute on “design for thermal”

Description

• Lead a small team of talented thermal, electrical engineers

• Architecture the thermal solutions to address chip energy efficiency and performance scaling

• Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels

• Optimize advanced IC design scheme/floor-planning to ensure good thermal performance

• Develop detailed and reduced-order thermal models

• Analyze simulation and measurement results to enhance product thermal management

Education

• MS in Mechanical Engineering and related fields, PhD degree preferred

Additional Requirements